SRC001 Hydrocarbon Series High Performance Material

SRC001 is a ceramic powder filled, glass fiber cloth impregnated thermosetting resin substrate material, with the advantages of high performance and low cost, its dielectric constant fluctuation with temperature is almost the lowest in the same material, in the wide frequency range, its dielectric constant is also quite stable.

Classification:

PTFE High Frequency Substrate

Email:

senrong@sdsenrong.com

Inquiry
Return

Introduction

The thermal expansion coefficient of SRC001 substrate material is similar to that of copper foil, which ensures the quality of the holes in the plate. The glass transition temperature is greater than 280℃, which ensures good dimensional stability in the process of plate processing. The fabrication process of SRC001 substrate material is simple and does not require through-hole pretreatment such as sodium etching. At the same time, it can be processed by automatic process system and copper surface pretreatment grinding plate equipment.

Features and Advantages

● Optimization of cost and RF/microwave performance

● Can be compatible with FR-4 processing technology including PCB multilayer structure

● Better thermal conductivity, better heat treatment capacity than traditional PTFE material 

● Compatible with lead-free welding process

● Low Z-axis thermal expansion coefficient improves the reliability of plating through holes

Technical Parameters

specificationValueDirectionUnitTest method
Dielectric constant (10GHz)3.48±0.05Z       -IPC-TM-650 2.5.5.5
Dissipation factor (10GHz)0.0032Z       -IPC-TM-650 2.5.5.5
Thermal coefficient (10GHz,-50℃~150℃)30Zppm/℃IPC-TM-650 2.5.5.5
Volume Resistivity (C/96/35/90)6.8×108ZMΩcmIPC-TM-650 2.5.17.1
Surface Resistivity (C/96/35/90)5.1×107ZMΩIPC-TM-650 2.5.17.1
Electric strength34ZKv/mmIPC-TM-650 2.5.6.2
Coefficient of Thermal Expansion (-55℃~288℃)10
12
35		X
Y
Z		ppm/℃IPC-TM-650 2.4.41
Glass Transition Temperature>280-℃IPC-TM-650 2.4.24.4
Thermal destruction temperature390-℃ASTM D3850
Thermal Conductivity (80℃)0.65ZW/m/KASTM D5470
Peel strength(1oz, After the Thermal Stress)4.6(0.8)-Ibs/in(N/mm)IPC-TM-650 2.4.8
Tensile Modulus9510(1358)
6890(984)		X
Y		MPa(kpsi)ASTM D638
Tensile Strength150(21.4)
130(18.6)		X
Y		MPa(kpsi)ASTM D638
Bending Strength239(34)     -MPa(kpsi)IPC-TM-650 2.4.4
Dimensional Stability<0.5X,Ymm/mIPC-TM-650 2.4.39A
Moisture Absorption0.07     -%IPC-TM-650 2.6.2.1
Density1.85    -g/cm³ASTM D792
FlammabilityV-0    -﹣UL94

Remark: The above typical values of product technical parameters are average values and are not applicable to product inspection standards
 

Typical Applications

 

Satellite television, Microstrip lines, cellular base station antennas and power amplifiers, Vehicle radar and sensors

Keyword:

SRC001 Hydrocarbon Series High Performance Material

Related Products

Leave A Message

Contact us for more preferential prices

Submit