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SRF002 Glass Fiber Reinforced PTFE Substrate
Introduction
SRF002 The in-plane dielectric properties of the substrate materials are uniform and stable, and can be kept consistent in a wide frequency range. The low loss factor can expand the application of the substrate materials to the frequency band of constant KU and above.
SRF002 The substrate material is easy to cut and process, and has good resistance to various cold and hot solvents or reagents used for etching printed circuits, electroplating sidelines and through holes.
SRF002 The substrate material can provide double-sided 1/2oz, 1oz or 2oz thick electrolytic copper foil or copper foil instead. In order to meet higher requirements for electrical applications, calendered copper foil can also be provided. In addition, aluminum clad plate, copper plate or brass plate can also be formulated.
Features and Advantages
● Electrical characteristics consistent with frequency change
● Low water absorption
● Minimum electrical losses in reinforced PTFE materials
● Excellent chemical resistance
Technical Parameters
| Property | Typical Value | Direction | Unit | Test Method |
|---|---|---|---|---|
| Dielectric Constant(10GHz) | 2.20+0.04 | Z | -- | IPC-TM-650 2.5.5.5 |
| Dissipation Factor(10GHz) | 0.0009 | Z | -- | IPC-TM-650 2.5.5.5 |
| Relative dielectric constant temperature coefficient (10GHz, -50℃~150℃) | -150 | Z | ppm/℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity(C/96/35/90) | 1.2x108 | Z | MΩ·cm | IPC-TM-650 2.5.17.1 |
| Surface Resistivity(C/96/35/90) | 2.3x106 | Z | MΩ | IPC-TM-650 2.5.17.1 |
| Coefficient of Thermal Expansion (0℃~150℃) | 30 45 250 | X Y Z | ppm/℃ | IPC-TM-650 2.4.41 |
| Thermal decomposition temperature |
500 | -- | ℃ | ASTM D3850 |
| Copper Peel Strength(1oz,after heat stress ) | 14.3(2.5) | -- | Lbs/in(N/mm) | IPC-TM-650 2.4.8 |
| Tensile modulus | 1100（160） | X.Y | MPa(kpsi) | ASTM D638 |
| Compression modulus | 700(102) | Z | MPa(kpsi) | ASTM D695 |
| Moisture Absorption | 0.02 | -- | % | IPC-TM-650 2.6.2.1 |
| Thermal Conductivity(80℃) | 0.27 | Z | W/m/K | ASTM D5470 |
| Density | 2.2 | -- | G/cm3 | ASTM D792 |
| Flammability | V-0 | -- | -- | UL 94 |
Typical Applications
Typical Applications, Commercial aerospace broadband antenna, Microstrip and stripline circuits, Millimeter wave equipment, Radar system, Point to point digital RF antenna
Keyword:
SRF002 Glass Fiber Reinforced PTFE Substrate
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