High-frequency flexible copper-clad laminate SRFP series

Low loss flexible high-frequency copper-clad laminate for 6G

Classification:

High frequency material series

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Product Introduction

Flexible circuit board material is a flexible copper-clad laminated composite material, which is the processing substrate material for flexible circuit boards. It is mainly composed of high-performance insulating base materials polyimide/fluoropolymer composite materials and flexible metal copper foil (rolled copper foil or electrolytic copper foil), and is specially designed for high-speed digital and high-frequency flexible circuit applications.

Application Areas

Flexible printed circuit boards for high-speed digital and high-frequency circuits 

Technical Parameters

Serial Number

Test Item

Unit

Test Standard

SRFP Series

1

Peel Strength 90°

MD

N/mm

IPC-TM-650 2.4.9

1.8

TD

1.9

2

Flame Retardancy

--

UL-94

V-0

3

Thermal Stress (288℃, 10S, 10 times)

--

IPC-TM-650 2.4.13

No delamination, no blistering

4

Dielectric Constant (10 GHz)

--

IEC 61189-2-721

2.78

5

Dielectric Loss Tangent (10 GHz)

--

IEC 61189-2-721

0.0012

6

Volume Resistivity

Ω·cm

ASTM D257

1.65*10 16

7

Dielectric Strength

kV/mm

ASTM D149

235

8

Linear Expansion Coefficient CTE (50-250℃)

ppm/℃

IPC-TM-650 2.4.24.5

26(X)/12(Y)

 

Product Specification Code Description

Regular Product Table

Product Model

Copper Foil Thickness

(μm)

Polyimide/Fluoropolymer Thickness

(μm)

Copper Foil Thickness

(μm)

Copper Foil Type

SRFP185018R

18

50

18

Rolled Copper Foil RA

SRFP187518R

18

75

18

Rolled Copper Foil RA

SRFP1810018R

18

100

18

Rolled Copper Foil RA

SRFP355035R

35

50

35

Rolled Copper Foil RA

SRFP357535R

35

75

35

Rolled Copper Foil RA

SRFP3510035R

35

100

35

Rolled Copper Foil RA

SRFP185018E

18

50

18

Electrolytic Copper Foil ED

SRFP187518E

18

75

18

Electrolytic Copper Foil ED

SRFP1810018E

18

100

18

Electrolytic Copper Foil ED

SRFP355035E

35

50

35

Electrolytic Copper Foil ED

SRFP357535E

35

75

35

Electrolytic Copper Foil ED

SRFP3510035E

35

100

35

Electrolytic Copper Foil ED

Note: Length, width and thickness can be customized according to customer requirements  

Keyword:

High-frequency flexible copper-clad laminate SRFP series

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