SRB001 Adhesive sheet material

SRB001 adhesive sheet material is a semi-CURED SHEET BASED ON CERAMIC powder filled THERMOSETTING resin and PTFE composite system, used for pressing and bonding multi-layer circuit board quality inspection. SRB001 adhesive sheet material can be used in millimeter wave radar, antenna, car collision avoidance radar and other fields. It can realize the bonding between multilayer substrates at low pressing temperature, and can be used for pressing multilayer circuit boards of various substrates such as PTFE, epoxy, LCP and hydrocarbon resin.

Classification:

PTFE High Frequency Substrate

Email:

senrong@sdsenrong.com

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Features and Advantages

● Dielectric constant 2.78

● The loss factor is 0.0019

● Lower pressing temperature

● Dielectric constant and size high thermal stability

● The adhesive sheet without glass fiber is compatible with the circuit components

Technical Parameters

Technical ParametersTypical ValueDirectionUnitsTest  method
Relative Dielectric Constant(10GHz)2.78±0.05z-IPC-TM-650 2.5.5.5
Loss Factor(10GHz)0.0019z-IPC-TM-650 2.5.5.5
Bolume Resistivity2.1x108zMΩ·cmIPC-TM-650 2.5.17.1
Surface Resistivity1.4x107zMΩIPC-TM-650 2.5.17.1
Breakdown Voltage45-KVIPC-TM-650 2.5.6
Glass Transition Temperature193℃-℃IPC-TM-650 2.4.24.4
Coefficient of Thermal Expansion（-55℃~125℃）60 80 110XYZPpm/℃IPC-TM-650 2.4.41
Thermal Decomposition Temperature416（2%）
441（5%）		-℃IPC-TM-650 2.4.24.6
Strength of Copper Foil Glass （1oz , After the thermal stress）6.9（1.2）-lbs/in(N/mm)IPC-TM-650 2.4.8
Water Absorption0.08-%IPC-TM-650 2.6.2.1
Thermal Conductivity（80℃）0.25ZW/m/KASTM D5470
Density1.8-G/cm3ASTM D792
Hardness68ZShore DASTM D2240

Typical Applications


Filters and couplers, Aerospace electronic equipment, The car radar, Flexible circuit board

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SRB001 Adhesive sheet material

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