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SRB002 Adhesive sheet material
Features and Advantages
- High frequency thermosetting bond sheet, and can be compatible with FR-4 bonding temperature
- It can be pressed multiple times
- The low Z-axis thermal expansion coefficient makes the through hole more reliable
- Compatible with lead-free welding processes
Technical Parameters
|
Technical Parameters |
Typical Value |
Direction |
Units |
Test method |
|---|---|---|---|---|
|
Relative Dielectric Constant(10GHz) |
3.52±0.05 |
z |
- |
IPC-TM-650 2.5.5.5 |
|
Loss Factor(10GHz) |
0.0037 |
z |
- |
IPC-TM-650 2.5.5.5 |
|
volume resistivity(C/96/35/90) |
1.4x109 |
z |
MΩ·cm |
IPC-TM-650 2.5.17.1 |
|
surface resistivity(C/96/35/90) |
6.8x107 |
z |
MΩ |
IPC-TM-650 2.5.17.1 |
|
electric strength |
35 |
z |
KV/rnm |
IPC-TM-650 2.5.6.2 |
|
glass transition temperature |
>280 |
- |
℃ |
IPC-TM-650 2.4.24.4 |
|
coefficient of thermal expansion(-55℃~288℃) |
20 22 72 |
XYZ |
Ppm/℃ |
IPC-TM-650 2.4.41 |
|
thermal decomposition temperature |
390 |
- |
℃ |
ASTM D3850 |
|
Strength of copper foil glass(1oz ,After the thermal stress) |
3.9(0.68) |
- |
lbs/in(N/mm) |
IPC-TM-650 2.4.8 |
|
thermal conductivity(80℃) |
0.62 |
z | W/m/K |
ASTM D5470 |
|
water absorption |
0.12 |
- |
W/m/K% |
IPC-TM-650 2.6.2.1 |
|
density |
1.83 |
- |
G/cm3 |
ASTM D792 |
|
fire resistance |
V-0 |
- |
- |
UL94 |
Typical Applications
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