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SRF003-3 Glass Fiber Cloth Reinforced Ptfe Substrate

SRF003-3 substrate material is based on PTFE high thermal conductivity ceramic powder filled glass fiber cloth reinforced circuit board material.
The SRF003-3 substrate material provides designers with a unique combination of low loss factor and high thermal conductivity to achieve superior reliability and lower operating temperatures for high-power equipment.
Product Description

Features and Advantages


● High heat conductivity

● Low thermal expansion coefficient

● Low loss factor

● Reduce the temperature of high-power equipment to improve reliability

● Improve broadband utilization and efficiency of amplifiers and antennas

●CTE matches active devices and low stress solder joints

●Reliable plated through holes

●Reduce heat generated by transmission line losses

●Support flexible PCB machining to optimize board size

Technical indicators

 

Specification

Value

Direction

Unit

Test method

Dielectric Constant (10GHz)

3.50±0.05

Z

    -

IPC-TM-650 2.5.5.5

Dissipation Factor (10GHz)

0.0021

Z

 

IPC-TM-650 2.5.5.5

Thermal Coefficient (10GHz,-40℃~150℃)

-10

Z

ppm/℃

IPC-TM-650 2.5.5.5

Volume Resistivity (C/96/35/90)

7.9×106

Z

MΩcm

IPC-TM-650 2.5.17.1

Surface Resistivity (C/96/35/90)

1.4×105

Z

IPC-TM-650 2.5.17.1

Breakdown Voltage

46

   -

ky

IPC-TM-650 2.5.6

Coefficient of Thermal Expansion (50℃~150℃)

15
15
30

X
Y
Z

ppm/℃

IPC-TM-650 2.4.41

Thermal Destruction Temperature

500

  -

IPC-TM-650 2.4.24.6

T260

>60

Z

min

IPC-TM-650 2.4.24.1

T288

>60

Z

min

IPC-TM-650 2.4.24.1

T300

>60

Z

min

IPC-TM-650 24.24.1

Peel Strength (1oz, After the Thermal Stress)

6.9(1.2)

  -

lbs/in(N/mm)

IPC-TM-650 2.4.8

Tensile Strength

72/51(10/7)

X,Y

MPa(kpsi)

IPC-TM-650 2.4.18.3

Bending Strength

91/65(13/9)

X,Y

MPa(kpsi)

IPC-TM-650 2.4.4

Moisture Absorption

0.05

-

 
%

IPC-TM-650 2.6.2.1

Thermal Conductivity (80℃)

0.73

Z

W/m/K

ASTM D5470

Density

2.3

   -

g/cm³

ASTM D792

Flammability

V-0

   -

   -

UL94

Remark: The above typical values of product technical parameters are average values and are not applicable to product inspection standards.
 

Typical Application


Power amplifier passive device, TMA, TMB, Thermal cycle and high reliability antenna sensitive to dielectric source shift, Microwave power synthesizer and distributor

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